The Wafer Two-Fluid Single-Side Brushing & Cleaning Spin-Dryer (SiC Cleaner with Two-Fluid Brushing Spin-Drying) consists of a single-station loading device, wafer manipulator device (with flipping capability), rotary brushing devices, single-station unloading device, FFU purification unit, electrical control system, piping system, and pneumatic system.
Product Parameters
1.Production Flow:
Load → Location → Rotation, brushing, cleaning, two-fluid spraying → Rotation, spin-drying → Unload
2.Major Materials:
Metal Frame
PP white board
3.Transportation:
Wafers are transported by a clean robotic hand.
Product Features and Applications
Removes residual particles from the wafer surface.
Product Details
Capacity of the washing chamber:
1 wafer
Typical production batch time:
approx. 144 sec/piece (brush time is adjustable)
Standard sizes:
6 inches (φ150mm) and 8 inches (φ200mm)
Non-standard sizes:
φ150~153mm and φ200~203mm
Application Scenarios
◇ In October 2023, the SiC Cleaner with Two-Fluid Brushing Spin-Drying completed R&D and entered test running.
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