The Wafer Megasonic Two-Sided Brushing & Cleaning Spin-Dryer (SiC Cleaner with Megasonic Brushing Spin-Drying) consists of a single-station loading device, wafer manipulator device (with flipping capability), rotary brushing devices, single-station unloading device, FFU purification unit, electrical control system, piping system, and pneumatic system.
Product Parameters
1.Production Flow:
Load → Location → Rotation, brushing, cleaning, two-fluid spraying (Si side) → Turn over 180° → Rotation, brushing, cleaning, megasonic spraying (C side) → Rotation, spin-drying → Unload
2.Major Materials:
Metal Frame
PP white board
3.Transportation:
Wafers are transported by a clean robotic hand.
Product Features and Applications
Removes residual particles from both surfaces of the wafer:
a. Particle size 0.3~0.5 µm: removal rate >90% or <200 particles;
b. Particle size 0.5~1 µm: removal rate >95% or <10 particles.
Note: Inspection machine is compatible with Candela or SICA.
Product Details
Capacity of the washing chamber:
1 wafer
Typical production batch time:
approx. 144 sec/piece (brush time is adjustable)
Standard sizes:
6 inches (φ150mm) and 8 inches (φ200mm)
Non-standard sizes:
φ150~153mm and φ200~203mm
Application Scenarios
◇ In October 2023, the SiC Cleaner with Megasonic Brushing Spin-Drying was commissioned and began operation as a demo unit at the customer site for Wuxi HY Solar.
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