The Double-Sided Mechanical Polishing Cleaner (SiC Cleaner After-DMP) features automatic heating, a constant temperature circulation device, an ultrasonic cleaning device, a spray fast-discharge bubbling overflow device, and a pipeline and electrical control system. Its functions are controlled by PLC and include adjustable cleaning time, cleaning completion prompt, temperature control adjustment, high and low liquid level alarms, overflow protection, and leakage detection alarm.
Product Parameters
1.Production Flow:
Load (Manual) → QDR Tank → OF Tank → Ultrasonic Cleaning Agent Tank → Ultrasonic Cleaning Agent Tank → QDR Tank → Unload (Manual)
2.Major Materials:
Metal frame: SUS 304
Ice-Cream PP board
Tank material: PPN + SUS 316
3.Transportation:
Manual
Product Features and Applications
Removes residual slurry and larger particles from the surface of SiC wafers after the Double-Sided Mechanical Polishing procedure.
Product Details
◆ 1.Capacity:
6" × 1 cassette (25 pcs)
8" × 1 cassette (25 pcs)
◆ 2.Cleaning Batch Time:
≤1 batch/10 min (cleaning procedure time is adjustable).
Application Scenarios
◇ In October 2024, the SiC Cleaner After-DMP was commissioned and began operation at the customer site for Tiancheng Semiconductor.
Hot Tags: SiC cleaner after-dmp, China SiC cleaner after-dmp manufacturers, Ceramic Plate Cleaner for SiC, SiC Cleaner After CMP, SiC Cleaner After DMP, SiC Cleaner with Megasonic Brushing Spin drying, SiC Cleaner with Two Fluid Brushing Spin drying, sic wafer clean bench
