The Integrated Cleaner for Wafer Degumming, Separating & Inserting (Wafer Degumming, Splitting & Cleaning Unit) is specially designed for automatic cleaning, removal of large particles, degumming, slicing, inserting, and chemical cleaning of semiconductor wafers. This equipment is suitable for 8-inch wafers and features a fully automated process including feeding, spray washing, ultrasonic cleaning, heating, degumming, plate removal, automatic slicing, cassette insertion, and chemical caustic washing.
The stacked wafers are separated one by one using a suction cup mechanism. Damaged wafers are identified and reported by a CCD system before being fed into an 8-inch wafer cassette. The full cassette is automatically inserted, and the transportation/unloading of cassettes from the degumming section is handled by an automatic manipulator. The manipulator arranges the full cassette and sends it to the subsequent cleaning machine's feeding station. The cleaning machine's manipulator then transports the cassette through two chemical cleaning tanks, two rinsing tanks, and a hot air drying process before final arrangement and output. The entire system is designed as a continuous process channel, requiring the operator only to load workpieces and cassettes.
The Integrated Cleaner is equipped with three barcode scanners for tracking process numbers and cassette IDs at loading, cleaning, and unloading positions. Wafer production management operates based on these codes. The touchscreen includes a front-mounted memory card for easy data retrieval, and recorded data can be directly accessed by the host computer. A thermal printer in the cassette loading process prints work order marks.
Key electrical components are imported from Omron, Mitsubishi, FESTO, SMC, and Keyence, ensuring reliable performance, long service life, and stable operation.
Product Parameters
Production Flow:
Load → QDR → Ultrasonic Alkali Cleaning → Degumming Tank → Splitting Tank → Inserting Mechanism → Scan & Transportation Mechanism → (Ultrasonic Alkali Tank 1 → Ultrasonic Alkali Tank 2 → Rinsing Tank 1 → Rinsing Tank with Slow Lifting 2 → Drying Tank 1 → Drying Tank 2 → Unload → Buffer)
Major Materials:
Metal Frame; tanks use SUS316 mirror plates.
Transportation:
Robotic arm transportation.
Product Features and Applications
Designed for wafer degumming, splitting, and cleaning.
Product Details
Compatible with two types of workpieces: ingot degumming and slicing (diamond wire cutting or slurry cutting).
- Capacity: 360 pieces/hour.
Application Scenarios
◇ In April 2024, the Wafer Degumming, Splitting & Cleaning Unit was commissioned and began operation at the customer site for CQAST.
◇ In November 2024 and January 2025, two additional units were commissioned and began operation at the customer site for JRH.
◇ This is a key product for Shengda Semiconductor Equipment.
Hot Tags: integrated cleaner for wafer deguming separating inserting, China integrated cleaner for wafer deguming separating inserting manufacturers, Integrated Cleaner for Wafer Deguming Separating Inserting, si wafer cleaning equipment, Wafer Separating Inserting Equipment
