The Automatic Wafer Degluing Cleaner primarily consists of the following components: loading, spray cleaning tank, ultrasonic cleaning tank, degluing tank, rinsing tank, and unloading. The key electrical control parts of the equipment are made of high-quality components, ensuring reliable performance and a long service life. The degumming equipment utilizes a three-gantry system for cleaning, which ensures stability and reliability.
Product Parameters
Loading cart → City water booster spraying → 40 kHz ultrasonic cleaning → Degluing (4 stages) → Rinsing tank → Outlet cart to the separating & cleaning cleaner
Product Features and Applications
The working principle involves mechanical vibration combined with strong ultrasonic penetration force to impact the workpiece surface, along with bubbling effects, to achieve silicon wafer degluing.
Product Details
High degluing efficiency
Low fragmentation rate
High cleanliness
Application Scenarios
In May 2025, the degumming equipment will be shipped to Reliance, India.
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